SAMSUNG Memory

M378B1G73DB0-CK0 - Samsung 1x 8GB DDR3-1600 UDIMM PC3-12800U Dual Rank x8 Module

Name: M378B1G73DB0-CK0 - Samsung 1x 8GB DDR3-1600 UDIMM PC3-12800U Dual Rank x8 Module
SKU: M378B1G73DB0-CK0-MDN

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Have a question about the M378B1G73DB0-CK0 - Samsung 1x 8GB DDR3-1600 UDIMM PC3-12800U Dual Rank x8 Module?
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This M378B1G73DB0-CK0 replacement is a proven memory product. It's either approved, certified or OEM qualified to ensure total reliability.

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Replacement

Nothing is perfect. Sometimes things happen. If your M378B1G73DB0-CK0 replacement upgrade fails at anytime–we will ship a replacement same day. We support your M378B1G73DB0-CK0 memory purchase long after the sale.

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Get ➔ Lifetime warranty ✓ Great savings ✓ Buy factory original SAMSUNG M378B1G73DB0-CK0 memory modules. The same modules specified at Dell, HP, IBM and other OEMs. This module is compliant to specifications for DDR3-1600 Unbuffered DIMM performance in Intel® platform systems.

The Truth in Memory

Computer makers do not manufacture memory! They only label modules with branded stickers increasing your cost! They buy from SAMSUNG, who makes the DRAM and assembles the modules.

Guaranteed by federal law - This M378B1G73DB0-CK0, Samsung 8GB (1x 8GB) Dual Rank x8 PC3-12800U (DDR3-1600) Unbuffered CAS-11 Memory Kit made by SAMSUNG does not affect or void OEM warranties.

The right memory. At the right price. Right here for you.

M378B1G73DB0-CK0 Memory Price Trend

Last updated: 24 December 2019

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Lifetime Warranty

Never worry. We support you long after the sale. If any module ever fails–we will replace at zero cost to you!

Features

Weight	0.1 lbs
Dimensions	5.125 x 0.039 x 1.181 in
Form Factor	UDIMM
Error Correction Code	non-ECC
Kit Qty	1x 8GB
Technology	DDR3-1600
Speed	PC3-12800U
Voltage	1.5V
Rank	2Rx8
Cas Latency	CL11
Height	STD
Made By	SAMSUNG

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M378B1G73DB0-CK0

M378B1G73DB0-CK0 Specifications

Capacity: 8GB
Memory Type: DDR3
ECC: Non-ECC
DIMM Type: UDIMM
Rank: 2Rx8
Speed: 1600
Voltage: 1.5V
Height: STD
Qty: 1
Module Name: PC3-12800U
Made By: Samsung
Form Factor: DIMM
Width: x64
Pins: 240 pin
Depth: 1G
Chip Size: 4Gb
Banks: 8 Banks, SSTL (1.5V)
Organization: x8
Package: FBGA (Lead-Free & Halogen-Free, Flip Chip)
Temperature: Commercial Temp.(0°C ~ 85°C)
Frequency: 800
CL: 11
TRCD: 11
TRP: 11

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