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M386B8G70DE0-YK0 - Samsung 1x 64GB DDR3-1600 LRDIMM PC3L-12800L Octa Rank x4 Module

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Have a question about the M386B8G70DE0-YK0 - Samsung 1x 64GB DDR3-1600 LRDIMM PC3L-12800L Octa Rank x4 Module?
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Compatible

This M386B8G70DE0-YK0 replacement is a proven memory product. It's either approved, certified or OEM qualified to ensure total reliability.

Quick Advance
Replacement

Nothing is perfect. Sometimes things happen. If your M386B8G70DE0-YK0 replacement upgrade fails at anytime–we will ship a replacement same day. We support your M386B8G70DE0-YK0 memory purchase long after the sale.

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M386B8G70DE0-YK0

Get ➔ Lifetime warranty ✓ Great savings ✓ Buy factory original SAMSUNG M386B8G70DE0-YK0 memory modules. The same modules specified at Dell, HP, IBM and other OEMs. This module is compliant to specifications for DDR3-1600 Load Reduced DIMM performance in Intel® platform systems.

The Truth in Memory

Computer makers do not manufacture memory! They only label modules with branded stickers increasing your cost! They buy from SAMSUNG, who makes the DRAM and assembles the modules.

Guaranteed by federal law - This M386B8G70DE0-YK0, Samsung 64GB (1x 64GB) Octal Rank x4 PC3L-12800L (DDR3-1600) Load Reduced CAS-11 Low Voltage Memory Kit made by SAMSUNG does not affect or void OEM warranties.

The right memory. At the right price. Right here for you.

M386B8G70DE0-YK0 Memory Price Trend

Last updated: 15 December 2024
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Lifetime Warranty

Lifetime Warranty

Never worry. We support you long after the sale. If any module ever fails–we will replace at zero cost to you!

Features

Weight .1 lbs
Dimensions 5.125 x 0.039 x 1.181 in
Form Factor

LRDIMM

Error Correction Code

ECC

Kit Qty

1x 64GB

Technology

DDR3-1600

Speed

PC3L-12800L

Voltage

1.35V

Rank

8Rx4

Cas Latency

CL11

Height

STD

Made By

SAMSUNG

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M386B8G70DE0-YK0

M386B8G70DE0-YK0 Specifications

Capacity
64GB
Memory Type
DDR3
ECC
ECC
DIMM Type
LRDIMM
Rank
8Rx4
Speed
1600
Voltage
1.35V
Height
STD
Qty
1
Module Name
PC3L-12800L
Made By
Samsung
Form Factor
DIMM
Width
x72
Pins
240 pin
Depth
8G
Chip Size
4Gb
Banks
8 Banks, SSTL (1.5V)
Organization
x4
Package
FBGA (Lead-Free & Halogen-Free, QDP)
Temperature
Commercial Temp.(0°C ~ 85°C)
Frequency
800
CL
11
TRCD
11
TRP
11

View M386B8G70DE0-YK0 full specifications on SAMSUNG logo

 

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Maximum size 10MB

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