SAMSUNG Memory

M391B1G73BH0-CK0 - Samsung 1x 8GB DDR3-1600 ECC UDIMM PC3-12800E Dual Rank x8 Module

Name: M391B1G73BH0-CK0 - Samsung 1x 8GB DDR3-1600 ECC UDIMM PC3-12800E Dual Rank x8 Module
SKU: M391B1G73BH0-CK0-MDN

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Have a question about the M391B1G73BH0-CK0 - Samsung 1x 8GB DDR3-1600 ECC UDIMM PC3-12800E Dual Rank x8 Module?
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This M391B1G73BH0-CK0 replacement is a proven memory product. It's either approved, certified or OEM qualified to ensure total reliability.

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Nothing is perfect. Sometimes things happen. If your M391B1G73BH0-CK0 replacement upgrade fails at anytime–we will ship a replacement same day. We support your M391B1G73BH0-CK0 memory purchase long after the sale.

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Get ➔ Lifetime warranty ✓ Great savings ✓ Buy factory original SAMSUNG M391B1G73BH0-CK0 memory modules. The same modules specified at Dell, HP, IBM and other OEMs. This module is compliant to specifications for DDR3-1600 Unbuffered DIMM performance in Intel® platform systems.

The Truth in Memory

Computer makers do not manufacture memory! They only label modules with branded stickers increasing your cost! They buy from SAMSUNG, who makes the DRAM and assembles the modules.

Guaranteed by federal law - This M391B1G73BH0-CK0, Samsung 8GB (1x 8GB) Dual Rank x8 PC3-12800E (DDR3-1600) Unbuffered CAS-11 Memory Kit made by SAMSUNG does not affect or void OEM warranties.

The right memory. At the right price. Right here for you.

M391B1G73BH0-CK0 Memory Price Trend

Last updated: 23 January 2021

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Lifetime Warranty

Never worry. We support you long after the sale. If any module ever fails–we will replace at zero cost to you!

Features

Weight	0.1 lbs
Dimensions	5.125 x 0.039 x 1.181 in
Rank	2Rx8
Cas Latency	CL11
Height	STD
Made By	SAMSUNG
Voltage	1.5V
Speed	PC3-12800E
Error Correction Code	ECC
Kit Qty	1x 8GB
Technology	DDR3-1600
Form Factor	UDIMM

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M391B1G73BH0-CK0

M391B1G73BH0-CK0 Specifications

Capacity: 8GB
Memory Type: DDR3
ECC: ECC
DIMM Type: UDIMM
Rank: 2Rx8
Speed: 1600
Voltage: 1.5V
Height: STD
Qty: 1
Module Name: PC3-12800E
Made By: Samsung
Form Factor: DIMM
Width: x72
Pins: 240 pin
Depth: 1G
Chip Size: 4Gb
Banks: 8 Banks, SSTL (1.5V)
Organization: x8
Package: FBGA (Lead-Free & Halogen-Free)
Temperature: Commercial Temp.(0°C ~ 85°C)
Frequency: 800
CL: 11
TRCD: 11
TRP: 11

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